Semiconductor manufacturing apparatus

Details Semiconductor manufacturing apparatus Semiconductor manufacturing apparatus

1991-05-20

1992-10-13

Hearn, Brian E.

Metal working

Barrier layer or semiconductor device making

437209, 228 491, 228443, H01L 2100

Patent

active

051547295

ABSTRACT:
The upper surface of a stage has first, second and third surfaces formed in a stepped configuration, the first and second surfaces are connected to each other by a first side surface and the second and third surfaces are connected to each other by a second side surface. A circular arc-form concave portion is formed in the side surface and a chip carrier is disposed on the second surface inside the concave portion. A depressing plate is disposed on the second surface so as to freely slide in a direction perpendicular to the first side surface. The depressing plate is fixed on a clamp member which is connected to a rotor rotatably mounted on the stage. The rotor is biased by means of a spring so as to move the depressing plate towards the concave portion. The depressing plate has a depressing portion which is set in parallel with the first side surface and the position of the chip carrier is determined by the depressing portion of the depressing plate and the internal surface of the concave portion.

REFERENCES:
patent: 4125252 (1978-11-01), Louanny
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 5020200 (1991-06-01), Mimasaka et al.

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