Semiconductor manufacturing apparatus

Details Semiconductor manufacturing apparatus Semiconductor manufacturing apparatus

2007-10-09

2007-10-09

MacArthur, Sylvia R. (Department: 1763)

Coating apparatus

Gas or vapor deposition

With treating means

C118S725000, C156S345520, C156S345530

Reexamination Certificate

active

10987304

ABSTRACT:
To provide a semiconductor manufacturing device, which is provided with a wafer holder capable of improving the cooling rate of a heater and retaining the homogeneity of the temperature distribution of the heater at cooling time and which can markedly shorten the time period for treating a semiconductor wafer.The wafer holder includes the heater1for carrying the semiconductor wafer thereon to heat the same, and the cooling block2for cooling the heater1. The cooling block2is arranged so as to come into and out of abutment against the back1bof the heater on the side opposed to the wafer carrying face1a, and its abutment face2ato abut against the heater1has a warpage of 1 mm or less. The cooling block2can be provided therein with a passage for a cooling liquid. It is preferred that the passage has a sectional area of 1 mm2or larger over 80% of its entire length, and that the area of the portion having the passage formed is 3% or larger of the entire area of the abutment face2a.

REFERENCES:
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patent: 2003-223971 (2003-08-01), None
patent: 2004-014655 (2004-01-01), None
patent: WO 99/45745 (1999-09-01), None
Japanese Office Action issued in corresponding Japanese Patent Application No. 2003-387741, dated Dec. 5, 2006.

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