Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2002-01-15
2004-10-26
Paladini, Albert W. (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S300000, C313S013000
Reexamination Certificate
active
06810299
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor manufacturing apparatus for manufacturing semiconductor devices or the like, and particularly, relates to a lighting device for an exposure device for performing photo-exposure.
2. Description of the Related Art
In recent years, semiconductor devices have become more minute, and accordingly, environments capable of even more minute working are necessary, with regard to semiconductor manufacturing apparatuses such as exposure devices and the like for manufacturing semiconductor devices and the like. Also, there is a need for improvement in the productivity and manufacturing efficiency of semiconductor manufacturing apparatuses.
As such, high-output light source devices are used for improving the productivity and manufacturing efficiency of semiconductor manufacturing apparatuses, thereby manufacturing and fabricating semiconductor devices with short exposure times.
With conventional exposure devices serving as the semiconductor manufacturing devices, exposure light emitted from the light source thereof is shielded or projected using a shielding device called a shutter, thereby controlling the amount of exposure light to a level appropriate for manufacturing the semiconductor devices and exposing a wafer via a reticle and lens. Normally, the light source for emitting the exposure light has been changed to one that emits a great amount of light, to reduce the amount of time of exposure for obtaining the proper amount of exposure light, thereby increasing the number of wafers processed per unit time, so as to increase productivity and increase the manufacturing efficiency of the exposure apparatus itself.
In this case, the exposure lamp, which is a light source having near-ultraviolet light-emitting properties, so that the amount of electrical power supplied to the exposure lamp is great, has changed from around 1 kW to several kW. Generally, lamps used as light sources for exposure apparatuses are lamps using discharge. A lighting device for lighting the lamp has a part called a starter unit connected thereto for starting the lighting, i.e., the discharge, so as to perform a lighting operation of generating high voltage for starting discharge at the time of the lighting. Also, following starting of the lighting and discharge, a current is constantly applied, thereby maintaining the state of discharge and lighting.
The starter unit generates noise, which affects the exposure apparatus due to the high voltage at the time of starting the lighting and discharge, and there has arisen a concern that this might cause malfunctioning of the exposure apparatus, damage to the electronic parts of the exposure apparatus, and so forth. Generally speaking, there are normally three types of noise caused by generation of high voltage for lighting and discharge: that generated from the lighting device itself including the starter unit, that generated from cables connecting the lighting device and the lamp, and that generated from the lamp itself.
In recent years, the amount of electrical power supplied to the exposure lamp has increased, and accordingly, the high voltage at the time of starting the lighting and the current constantly flowing are both greater, so the noise generated also increases.
First, with regard to the noise generated from the lighting device itself, the entire lighting device is enclosed in a metal housing, so noise leaking out from the lighting device can be kept to a level not greater than that with conventional arrangements by means of grounding the housing or so forth, even with greater levels of noise being generated.
Second, with regard to the noise generated from the cables connecting the lamp with the lighting device, the increased electrical power being supplied to the lamp means that the current flowing through the cables is also greater, so the cables must be upgraded to cables one or two steps heavier. Further shielding the heavier cables results in even bulkier cables and creates a problem of increased space that is required for the bulkier cables.
Third, with regard to the noise generated from the lamp itself, the lamp house unit where the lamp is disposed is also contained in a metal housing similar to that of the lighting device, so noise leaking out from the lamp box can be kept to a level not greater than that with conventional arrangements by means of grounding the housing and so forth, even with greater levels of noise being generated, as with the case of the lighting device. Also, an increase in the size of the lamp results in increased heat generated from the lamp itself and increased heat generated from the electrical power source unit within the lighting device, meaning the cooling devices for cooling these elements must be disposed at various locations, so the increased cooling devices and increased space required for the increased cooling devices have become problematic as well.
SUMMARY OF THE INVENTION
The present invention has been made in light of the above problems, and accordingly, it is an object thereof to provide a semiconductor manufacturing apparatus whereby generation of noise accompanying increased electrical power supplied to the lamp is maintained at a level equal to or less than that of conventional arrangements, and the space required for installing increasingly larger semiconductor manufacturing apparatuses is maintained at a scale equal to or smaller than that of conventional arrangements, thereby lightening the overall task of installing the semiconductor manufacturing apparatus including the related cables.
It is another object of the present invention to provide a semiconductor manufacturing apparatus whereby the efficiency of the cooling device (temperature-adjusting device) is improved, and electrical power used for the cooling (temperature adjusting) is reduced, and thus conserved.
To this end, according to a first aspect of the present invention, a semiconductor manufacturing apparatus comprises a light source and a lighting device, the lighting device comprises an electrical power source unit for supplying electricity to the light source and a starter unit for lighting the light source, wherein the starter unit has a metal piece for connecting the lighting device to the light source.
Also, according to a second aspect of the present invention, a semiconductor manufacturing apparatus comprises: a light source; a lighting device for lighting the light source; and a connector for connecting the light source and the lighting device with a metal piece.
The light source may be a discharge lamp, the light source and the lighting device may be disposed within a single housing, and the housing may have outer walls provided with electromagnetic shielding and a configuration of copper wire mesh sandwiched between thermal insulating material, the copper wire mesh being grounded.
The metal piece may be disposed at a side wherein high voltage is applied for lighting the light source. Also, the semiconductor manufacturing apparatus may further have a mechanism for integrally driving the light source and the lighting device.
The semiconductor manufacturing apparatus may further comprise means for changing the positional relation between the light source and an optical element disposed near the light source.
Also, the temperature of the light source and the lighting device may be adjusted using air of the ambient atmosphere outside the housing, taken into the housing from a single air intake and subjected to temperature adjustment with a single temperature adjusting means.
The light source and the lighting device may be subjected to temperature adjustment in the order of the lighting device first and then the light source, using the taken in air.
The semiconductor manufacturing apparatus according to the second aspect may further comprise a computer having a display, a network interface, and networking software, wherein data communication of maintenance information regarding the semiconductor manufacturing apparatus can be performed via a
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Frank Elliot L
Paladini Albert W.
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