Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1991-04-23
1992-10-20
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429806, 20419212, 2041923, C23C 1434
Patent
active
RE0341061
ABSTRACT:
A semiconductor manufacturing for depositing an insulating thin film on a surface of a semiconductor substrate in a vacuum vessel at an atmosphere of reduced pressure, wherein radiofrequency powers each having different first and second radiofrequencies are applied respectively to a target electrode composed of a material for an insulating thin film and a succeptor electrode for holding said semiconductor substrate. The first frequency is selected to be lower than said second frequency, whereby a high quality insulating film having a surface excellent in flatness can be assured without damaging the substrate.
REFERENCES:
patent: 3704219 (1972-11-01), McDowell
patent: 4525262 (1985-06-01), Class et al.
patent: 4579618 (1986-04-01), Celestino et al.
J. L. Vossen and J. J. O'Neill, Jr. Ultra Stable System for RF Sputtering With RF-Induced Substrate Bias.
H. Norstrom Experimental And Design Information For Calculating Impedance Matching Networks For Use In RF Sputtering And Plasma Chemistry.
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