Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2006-10-17
2006-10-17
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S022000, C438S024000, C438S046000, C438S047000, C438S479000
Reexamination Certificate
active
07122446
ABSTRACT:
Part of light emitted downward by an active layer is reflected by an electrode functioning as a reflective layer, and travels upward to radiate outside. Since the electrode is made of a metal, it reflects almost all light regardless of its incident angle, and light can be efficiently extracted.
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Furukawa Chisato
Nitta Koichi
Okazaki Haruhiko
Watanabe Yukio
DLA Piper (US) LLP
Kabushiki Kaisha Toshiba
Louie Wai-Sing
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