Semiconductor light emitting device with ridged contact

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With heterojunction

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257 99, 257101, 257622, 372 48, 372 45, 372 46, 437906, 437 23, 437 24, H01L 3300

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active

053410025

ABSTRACT:
A semiconductor device for amplifying radiation comprises an n-type substrate (1), a p-type layer (3) between which is located an active layer (2). Portions of the p-type layer (3) are removed by an etching process to create a central contact portion (11). Typically, the p-type layer portions are removed by an etching process in combination with a photoresist mask deposited on the top surface of the p-type layer (3). By using an etching process the contact portion can be shaped so that the photoresist layer then overhangs the contact portion (11). N-type ions are then implanted into the active layer (2) where the p-type layer (3) has been removed and the overhanging photoresist layer (4) creates non-implanted regions (10) in the active layer (20) which separates the implanted regions (8, 9) from the contact portion (11). The implanted regions (8, 9) have the effect of creating a potential barrier between the non-implanted regions of the first layer and the implanted regions and this prevents current injected into the contact portion (11) from spreading horizontally in the active layer (2).

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N. K. Dutta et al., "Fabrication and Performance Characteristics of InGaAsP Ridge-Guide Distributed-Feedback Multi-Quantum-Well Lasers", Electronics Lettersvol. 21, No. 13, Jun. 20, 1985, (Stevenage, Herts, GB), pp. 571,573.
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