Semiconductor light emitting device substrate strips and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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C257S098000, C257SE33001, C257SE33061

Reexamination Certificate

active

08039848

ABSTRACT:
Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

REFERENCES:
patent: 4918497 (1990-04-01), Edmond
patent: 4966862 (1990-10-01), Edmond
patent: 5027168 (1991-06-01), Edmond
patent: 5210051 (1993-05-01), Carter, Jr.
patent: 5277840 (1994-01-01), Osaka et al.
patent: 5338944 (1994-08-01), Edmond et al.
patent: 5393993 (1995-02-01), Edmond et al.
patent: 5416342 (1995-05-01), Edmond et al.
patent: 5523589 (1996-06-01), Edmond et al.
patent: 5604135 (1997-02-01), Edmond et al.
patent: 5631190 (1997-05-01), Negley
patent: 5739554 (1998-04-01), Edmond et al.
patent: 5813753 (1998-09-01), Vriens et al.
patent: 5858278 (1999-01-01), Itoh et al.
patent: 5912477 (1999-06-01), Negley
patent: 5959316 (1999-09-01), Lowery
patent: 5998925 (1999-12-01), Shimizu et al.
patent: 6069440 (2000-05-01), Shimizu et al.
patent: 6120600 (2000-09-01), Edmond et al.
patent: 6187606 (2001-02-01), Edmond et al.
patent: 6201262 (2001-03-01), Edmond et al.
patent: 6204523 (2001-03-01), Carey et al.
patent: 6252254 (2001-06-01), Soules et al.
patent: 6274924 (2001-08-01), Carey et al.
patent: 6518600 (2003-02-01), Shaddock
patent: 6521916 (2003-02-01), Roberts et al.
patent: 6635363 (2003-10-01), Duclos et al.
patent: 6747406 (2004-06-01), Bortscheller et al.
patent: 7126274 (2006-10-01), Shimizu et al.
patent: 7215074 (2007-05-01), Shimizu et al.
patent: 7355284 (2008-04-01), Negley
patent: 2001/0042865 (2001-11-01), Oshio et al.
patent: 2002/0123164 (2002-09-01), Slater, Jr. et al.
patent: 2003/0006418 (2003-01-01), Emerson et al.
patent: 2003/0168670 (2003-09-01), Roberts et al.
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0056260 (2004-03-01), Slater, Jr. et al.
patent: 2006/0103302 (2006-05-01), Tanaka et al.
patent: 2008/0017875 (2008-01-01), Lee et al.
patent: 1773738 (2006-05-01), None
patent: 54-19660 (1979-02-01), None
patent: 2521021 (1996-10-01), None
patent: 2005-116817 (2005-04-01), None
patent: 2005-277380 (2005-10-01), None
patent: 2005-537655 (2005-12-01), None
patent: 2006-148147 (2006-06-01), None
patent: 2006-173561 (2006-06-01), None
patent: WO 2004021459 (2004-03-01), None
U.S. Appl. No. 11/751,990, filed May 22, 2007, Negley.
International Search Report and Written Opinion (9 pages) corresponding to International Application No. PCT/US07/12158; Mailing Date: May 2, 2008.
International Search Report and Written Opinion (6 pages) corresponding to International Application No. PCT/US07/12158; Mailing Date: Jun. 9, 2008.
Notification of Transmittal of International Preliminary Report on Patentability (11 pages) corresponding to International Application No. PCT/US07/12158; Mailing Date: Nov. 3, 2008.
Notice of Office Action issued Sep. 7, 2010 during examination of the corresponding Chinese patent application No. 200710142646.3 (10 pages).
Official Action corresponding to Japanese Patent Application No. 2007-214709; Dispatch date Mar. 4, 2011; 16 pages.

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