Semiconductor light-emitting device, semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257SE23031, C257SE23008, C257SE23175, C257SE25020, C257SE33072, C257S685000, C257S723000, C257S784000, C257S737000

Reexamination Certificate

active

07605452

ABSTRACT:
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.

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patent: 5643834 (1997-07-01), Harada et al.
patent: 7169652 (2007-01-01), Kimura
patent: 7215403 (2007-05-01), Kimura
patent: 2002/0023342 (2002-02-01), Nakamura
patent: 2004/0126911 (2004-07-01), Kimura
patent: 2004/0214374 (2004-10-01), Sakamoto et al.
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 2006/0055309 (2006-03-01), Ono et al.
patent: 2008/0032142 (2008-02-01), Tasumi et al.
patent: 11-4080 (1997-06-01), None
patent: 2003-21839 (2003-01-01), None
patent: 2004-253328 (2004-09-01), None

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