Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-09-12
2009-10-20
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23031, C257SE23008, C257SE23175, C257SE25020, C257SE33072, C257S685000, C257S723000, C257S784000, C257S737000
Reexamination Certificate
active
07605452
ABSTRACT:
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.
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Kishimoto Kiyoharu
Tsukamoto Hiroyuki
Yamanaka Toshihiro
Hitachi Maxell Ltd.
Oliff & Berridg,e PLC
Williams Alexander O
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