Semiconductor light-emitting device package and method of manufa

Details Semiconductor light-emitting device package and method of manufa Semiconductor light-emitting device package and method of manufa

1997-05-14

2000-02-15

Picardiat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

060252138

ABSTRACT:
A surface-emission semiconductor light-emitting device package can radiate heat from the front surface while emitting light to the front surface of the device. The package includes a semiconductor light-emitting device for emitting light to a semiconductor substrate in the upper direction and a package window portion formed of a transparent heat sink, wherein the semiconductor light-emitting device is bonded to the package window portion in accordance with an interconnection pattern. A method of manufacturing semiconductor light-emitting device package also is described.

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patent: 5352852 (1994-10-01), Chun
patent: 5376580 (1994-12-01), Kish et al.
patent: 5498883 (1996-03-01), Lebby et al.
patent: 5606181 (1997-02-01), Sakuma et al.
patent: 5869891 (1999-02-01), Rostoker et al.

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