Semiconductor light-emitting device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S079000, C257S099000, C257S100000, C257SE33056, C257SE33059, C257SE33065, C257SE33069, C257SE33072, C313S512000, C362S237000, C362S555000

Reexamination Certificate

active

07985973

ABSTRACT:
The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

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patent: 6707166 (2004-03-01), Noguchi
patent: 7391153 (2008-06-01), Suehiro et al.
patent: 2004/0173810 (2004-09-01), Lin et al.
patent: 1436374 (2003-08-01), None
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patent: 1538538 (2004-10-01), None
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patent: 2004260048 (2004-09-01), None
English Abstract of CN1436374.
English Abstract of CN1466782.
English Abstract of CN1538538.
English Abstract of CN2612075.
English Abstract of JP2004260048.
English Abstract of TWM261835.
Office Action in related U.S. Appl. No. 11/921,176 dated Sep. 4, 2009.
International Search Report of PCT/CN2006/001165 dated Aug. 10, 2006.

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