Semiconductor light emitting device and method of...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S029000, C257S095000, C257S098000, C257S099000, C257S100000, C257SE33061

Reexamination Certificate

active

07955878

ABSTRACT:
A semiconductor light emitting device can include a casing having a concave-shaped cavity with an opening, a semiconductor light emitting element installed in a bottom portion of the cavity, and a resin layer for filling an interior of the cavity. The resin layer can include a wavelength conversion material, and can be formed in a convex shape in a light radiation direction of the light emitting element. In the resin layer a layer with a high density of the wavelength conversion material can be formed near a surface of the convex shape.

REFERENCES:
patent: 5959316 (1999-09-01), Lowery
patent: 6066861 (2000-05-01), Hohn et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 6277301 (2001-08-01), Hohn et al.
patent: 6340824 (2002-01-01), Komoto et al.
patent: 6576930 (2003-06-01), Reeh et al.
patent: 6592780 (2003-07-01), Hohn et al.
patent: 6613247 (2003-09-01), Hohn et al.
patent: 6653661 (2003-11-01), Okazaki
patent: 6669866 (2003-12-01), Kummer et al.
patent: 6774401 (2004-08-01), Nakada et al.
patent: 6809342 (2004-10-01), Harada
patent: 6812500 (2004-11-01), Reeh et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 7075116 (2006-07-01), Okazaki
patent: 2001/0000622 (2001-05-01), Reeh et al.
patent: 2003/0214233 (2003-11-01), Takahashi et al.
patent: 2003/0230751 (2003-12-01), Harada
patent: 2004/0041222 (2004-03-01), Loh
patent: 10-190065 (1998-07-01), None
patent: 2000-228544 (2000-08-01), None
patent: 2001-127346 (2001-05-01), None
patent: 2001-196639 (2001-07-01), None
patent: 2001-210872 (2001-08-01), None
patent: 2001-345483 (2001-12-01), None
patent: 2001-151743 (2002-05-01), None
patent: 2003-46133 (2003-02-01), None
patent: 2003-234511 (2003-08-01), None
patent: 2003-318448 (2003-11-01), None
patent: 2004-056075 (2004-02-01), None
Nov. 27, 2007 Office Action issued by Japan Patent Office in related Japanese patent application.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor light emitting device and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor light emitting device and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor light emitting device and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2715772

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.