Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-06-07
2011-06-07
Fahmy, Wael M (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S029000, C257S095000, C257S098000, C257S099000, C257S100000, C257SE33061
Reexamination Certificate
active
07955878
ABSTRACT:
A semiconductor light emitting device can include a casing having a concave-shaped cavity with an opening, a semiconductor light emitting element installed in a bottom portion of the cavity, and a resin layer for filling an interior of the cavity. The resin layer can include a wavelength conversion material, and can be formed in a convex shape in a light radiation direction of the light emitting element. In the resin layer a layer with a high density of the wavelength conversion material can be formed near a surface of the convex shape.
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Fahmy Wael M
Ingham John C
Kenealy Vaidya LLP
Stanley Electric Co. Ltd.
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