Semiconductor light-emitting device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Light responsive structure

Reexamination Certificate

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C257S189000, C257S191000, C257SE33025

Reexamination Certificate

active

10817800

ABSTRACT:
An n-type buffer layer composed of n-type GaN, an n-type cladding layer composed of n-type AlGaN, an n-type optical confinement layer composed of n-type GaN, a single quantum well active layer composed of undoped GaInN, a p-type optical confinement layer composed of p-type GaN, a p-type cladding layer composed of p-type AlGaN, and a p-type contact layer composed of p-type GaN are formed on a substrate composed of sapphire. A current blocking layer formed in an upper portion of the p-type cladding layer and on both sides of the p-type contact layer to define a ridge portion is composed of a dielectric material obtained by replacing some of nitrogen atoms composing a Group III–V nitride semiconductor with oxygen atoms.

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Hiroyuki Masato, et al., “Novel High Drain Brekdown Voltage AlGaN/GaN HFETs using Selective Thermal Oxidation Process”, International Electron Devices Meeting, pp. 377-380, (Dec. 10, 2000).
Kaoru Inoue, et al., “Novel GaN-based MOS HFETs with Thermally Oxidized Gate Insulator”, International Electron Meeting, pp. 577-580, (Dec. 2, 2001).

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