Semiconductor light emitting device and its manufacturing...

Details Semiconductor light emitting device and its manufacturing... Semiconductor light emitting device and its manufacturing...

2006-10-24

2006-10-24

Louie, Wai-Sing (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S024000, C438S046000, C438S047000, C438S493000, C438S503000, C438S507000

Reexamination Certificate

active

07125732

ABSTRACT:
In a semiconductor light emitting device such as a semiconductor laser using nitride III-V compound semiconductors and having a structure interposing an active layer between an n-side cladding layer and a p-side cladding layer, the p-side cladding layer is made of an undoped or n-type first layer9and a p-type second layer12that are deposited sequentially from nearer to remoter from the active layer. The first layer9is not thinner than 50 nm. The p-type second layer12includes a p-type third layer having a larger band gap inserted therein as an electron blocking layer. Thus the semiconductor light emitting device is reduced in operation voltage while keeping a thickness of the p-side cladding layer necessary for ensuring favorable optical properties.

REFERENCES:
patent: 5959307 (1999-09-01), Nakamura et al.
patent: 6165812 (2000-12-01), Ishibashi et al.
patent: 2002/0084452 (2002-07-01), Ota et al.
patent: 9-219556 (1997-08-01), None
patent: 11-251684 (1998-02-01), None
patent: 2000-183462 (1998-12-01), None
patent: 2000-269548 (1999-03-01), None
patent: 2000-349398 (1999-06-01), None

Affiliated with

Also associated with

Rating

Semiconductor light emitting device and its manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor light emitting device and its manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor light emitting device and its manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3632357