Semiconductor leadframe structure compatible with differing bond

Details Semiconductor leadframe structure compatible with differing bond Semiconductor leadframe structure compatible with differing bond

1995-03-06

1996-06-25

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257676, 257782, 257672, 257735, H01L 2348, H01L 2952, H01L 2328

Patent

active

055302840

ABSTRACT:
A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).

REFERENCES:
patent: 4451845 (1984-05-01), Philotsky et al.
patent: 4947236 (1990-08-01), Suga et al.
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5277356 (1994-01-01), Kawauchi
patent: 5313095 (1994-05-01), Tagawa et al.
patent: 5338704 (1994-08-01), Imai et al.
patent: 5399905 (1995-03-01), Honda et al.

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