Semiconductor lead frame having connection bar and guide rings

Details Semiconductor lead frame having connection bar and guide rings Semiconductor lead frame having connection bar and guide rings

1995-08-29

1998-03-03

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, 257707, 257784, 257667, 257670, 257691, H01L 23495

Patent

active

057238995

ABSTRACT:
A lead frame for semiconductor packages is disclosed. In the lead frame, some of the inner leads in the four sides are extended and provided with connection bars on their inside ends. Alternatively, diagonally arranged tie bars of the lead frame are extended and provided with a rectangular guide ring on their inside ends. The connection bar or guide ring functions as a dam for restricting possible overflow of adhesive, which adhesive is applied on the heat sink for bonding a semiconductor chip to the heat sink. The lead frame of the invention also prevents waste of expensive tape by letting the adhesive tape adhere only to the connection bars or to a given portion of the guide ring when mounting the lead frame to the heat sink and makes it possible higher integration of semiconductor chip by making connection bar and guide ring from the lead or the tie bar.

REFERENCES:
patent: 5121300 (1992-06-01), Shimizu
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5235207 (1993-08-01), Ohi et al.
patent: 5309019 (1994-05-01), Moline et al.
patent: 5420758 (1995-05-01), Liang
patent: 5455454 (1995-10-01), Oh et al.
patent: 5498901 (1996-03-01), Chillara et al.
patent: 5543657 (1996-08-01), Diffenderfer et al.

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