Semiconductor lead frame and method for manufacturing the same

Details Semiconductor lead frame and method for manufacturing the same Semiconductor lead frame and method for manufacturing the same

1998-08-14

2000-07-18

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257696, 257673, 257712, 257713, H01L 23435

Patent

active

060911344

ABSTRACT:
A semiconductor device manufacturing method and a semiconductor lead frame and its manufacturing method are disclosed. The semiconductor lead frame, in one form, comprises a chip pad section on which a semiconductor chip is mounted and a lead section including inner leads that are wire-bonded to electrodes of the semiconductor chip and outer leads that protrude out from the lead frame after packaging. Further, when the pad section and the lead section are connected together using a folding portion, which has not been folded, then the chip pad section sits apart from the lead section without overlapping. When the folding portion is folded, the ends of the inner leads of the lead section overlap the chip pad section and are located around a semiconductor chip mounting position of the chip pad section. Other forms of the semiconductor lead frame and various forms of the above-mentioned manufacturing methods are also disclosed.

REFERENCES:
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5161304 (1992-11-01), Queyssac et al.
patent: 5294876 (1994-03-01), Marcantonio et al.
patent: 5386142 (1995-01-01), Liang et al.
patent: 5394751 (1995-03-01), Ishibashi
patent: 5420758 (1995-05-01), Liang
patent: 5637915 (1997-06-01), Sato et al.
patent: 5703398 (1997-12-01), Sono et al.
patent: 5734198 (1998-03-01), Stave
patent: 5757070 (1998-05-01), Fritz
patent: 5763949 (1998-06-01), Woodworth et al.
patent: 5783860 (1998-07-01), Jeng et al.

Affiliated with

Also associated with

Rating

Semiconductor lead frame and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor lead frame and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor lead frame and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2039520