Semiconductor laser with encapsulated lead members

Details Semiconductor laser with encapsulated lead members Semiconductor laser with encapsulated lead members

1992-07-15

1994-05-03

Davie, James W.

Coherent light generators

Particular temperature control

Heat sink

257 99, 257100, 257787, 257796, H01S 304

Patent

active

053094603

ABSTRACT:
A semiconductor laser device is comprised of a first lead member having a mounting portion for mounting a semiconductor laser, at least one second lead member to be connected to the semiconductor laser, and a resin mold member for unitarily molding the first and second lead members, wherein the resin mold member has a recess portion for receiving the semiconductor laser therein and for exposing therein the mounting portion of the first lead member and a part of the second lead member, and wherein the semiconductor laser is electrically connected to the first and second lead members within the recess portion.

REFERENCES:
patent: 5140384 (1992-08-01), Tanaka

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