Semiconductor laser module having a co-axial package and...

Details Semiconductor laser module having a co-axial package and... Semiconductor laser module having a co-axial package and...

2007-03-13

2007-03-13

Healy, Brian M. (Department: 2883)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S088000, C385S052000, C385S014000, C372S043010, C372S050100

Reexamination Certificate

active

10854857

ABSTRACT:
The present invention provides a semiconductor laser module in which parasitic inductance due to the bonding wire is removed, accordingly, the high frequency performance thereof can be enhanced. The laser module of the present invention has a sub-mount, on which the semiconductor laser diode is installed and transmission lines for supplying the signal to the laser diode is formed. The transmission lines on the sub-mount are directly connected to corresponding lead pins provided in the base of the package without any bonding wires. Between the lead pins and under the sub-mount is provided a photo diode for monitoring light emitted from the laser diode.

REFERENCES:
patent: 6932518 (2005-08-01), Greenlaw
patent: 2002/0168153 (2002-11-01), Yamabayashi et al.
patent: 2003/0214860 (2003-11-01), Greenlaw
patent: 2004/0037334 (2004-02-01), Funada et al.
patent: 2004/0090620 (2004-05-01), Farr
patent: 2006/0083517 (2006-04-01), Saito et al.
patent: 11-233876 (1999-08-01), None

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