Semiconductor laser module

Details Semiconductor laser module Semiconductor laser module

2005-11-01

2005-11-01

Wong, Don (Department: 2821)

Coherent light generators

Particular temperature control

C372S036000, C372S043010

Reexamination Certificate

active

06961357

ABSTRACT:
In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W≧0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.

REFERENCES:
patent: 6802655 (2004-10-01), Yokoyama et al.
patent: 6810049 (2004-10-01), Wakisaka et al.
patent: 2002/0121671 (2002-09-01), Wakisaka et al.
patent: 2003/0053502 (2003-03-01), Wakisaka et al.
patent: 2003/0151059 (2003-08-01), Wakisaka et al.
patent: A-5-299699 (1993-11-01), None
patent: A-2001-168445 (2001-06-01), None

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