Semiconductor laser module

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 92, 385 49, G02B 636

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active

056849028

ABSTRACT:
In a semiconductor laser module wherein a semiconductor laser chip having a light emitting facet and an optical fiber having a fiber facet are mounted on a module substrate so that the light emitting facet faces the fiber facet, the semiconductor laser chip includes semiconductor layers disposed on a semiconductor substrate and including a light emitting region, and the semiconductor substrate has a portion protruding beyond the light emitting facet. The optical fiber includes a core extending in the optical waveguide direction and a cladding part surrounding the core. In this module, positioning of the optical fiber in the optical axis direction is performed by abutting a portion of the cladding part at the fiber facet against the protruding portion of the substrate of the semiconductor laser chip. Therefore, alignment of the optical fiber with the laser chip in the optical axis direction is performed easily and accurately with a desired spacing between them, without contacting the light emitting facet of the laser chip to the fiber facet, whereby coupling efficiency between the laser chip and the optical fiber is significantly improved.

REFERENCES:
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patent: 5544269 (1996-08-01), Hattori
patent: 5559918 (1996-09-01), Furuyama et al.
patent: 5562838 (1996-10-01), Wojnarowski et al.
Itoh, "Optical Device Passive Alignment Technology For Surface Mount Module", The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, vol. 10, No. 5, 1995, pp. 302-205.
Yano, "Packaging Architecture In Lightwave Communication", The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, vol. 10, No. 5, 1995, pp. 325-329.

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