Semiconductor laser diode assembly and method of manufacturing t

Details Semiconductor laser diode assembly and method of manufacturing t Semiconductor laser diode assembly and method of manufacturing t

1998-11-19

2000-07-18

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

060906421

ABSTRACT:
There is disclosed a semiconductor laser diode assembly. A semiconductor laser diode emits a beam of light. A ring member has a heat sink formed integral therewith. The semiconductor laser diode is mounted on the heat sink through a sub-mount. A common electrode is formed integral with the ring member. The common electrode extends opposite to the heat sink. Lead electrodes are held by the ring member through an insulating material filled therebetween in an airtight manner. A stem unit formed by the ring member, the lead electrodes, and the insulating material to provide electrical connection to the semiconductor laser diode. A cap unit fixed on the stem unit for hermetically sealing the semiconductor laser diode. The cap unit has a window through which a beam of light emitted by the semiconductor laser diode is radiated. The semiconductor laser diode assembly is made compact in size and easy to manufacture, providing a source of laser beam adapted for CD players, CD-ROM players and so on.

REFERENCES:
patent: 4692208 (1987-09-01), Khoe et al.
patent: 5089861 (1992-02-01), Tanaka et al.
patent: 5140384 (1992-08-01), Tanaka et al.
patent: 5245620 (1993-09-01), Tanaka et al.
patent: 5578863 (1996-11-01), De Poorter

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