Semiconductor laser device with a strain reduction cushion...

Details Semiconductor laser device with a strain reduction cushion... Semiconductor laser device with a strain reduction cushion...

2005-11-22

2005-11-22

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular active media

Semiconductor

C372S043010

Reexamination Certificate

active

06967982

ABSTRACT:
A semiconductor laser element is fixed onto a submount by forming a metallic thin film at a region on a surface of a p-side electrode of the semiconductor laser element. A periphery of the thin metallic thin film is recessed from a periphery of the p-side electrode by a predetermined width. The metallic thin film is thermally processed together with the p-side electrode for increasing a size of the grains and connected through a solder layer to the submount. Parts of the p-side electrode and the submount, the metallic thin film and the solder layer include Au for improving a cushion function of the semiconductor laser device.

REFERENCES:
patent: 3946334 (1976-03-01), Yonezu et al.
patent: 4589116 (1986-05-01), Westermeier
patent: 5729561 (1998-03-01), Hironaka
patent: 6212212 (2001-04-01), Honmou
patent: 6474531 (2002-11-01), Ozawa
patent: 6479325 (2002-11-01), Ozawa
patent: 6720581 (2004-04-01), Ozawa
patent: 6743702 (2004-06-01), Goto et al.
patent: 6761303 (2004-07-01), Ozawa
patent: 6810049 (2004-10-01), Wakisaka et al.
patent: 2002/0121863 (2002-09-01), Morishita
patent: 2002/0150134 (2002-10-01), Kawai
patent: 2003/0020161 (2003-01-01), Saitoh et al.

Affiliated with

Also associated with

Rating

Semiconductor laser device with a strain reduction cushion... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor laser device with a strain reduction cushion..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor laser device with a strain reduction cushion... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3503931