Semiconductor laser device structure, thermally assisted...

Details Semiconductor laser device structure, thermally assisted... Semiconductor laser device structure, thermally assisted...

2008-08-25

2010-10-26

Neyzari, Ali (Department: 2627)

Dynamic information storage or retrieval

Storage or retrieval by simultaneous application of diverse...

Magnetic field and light beam

C360S059000

Reexamination Certificate

active

07821880

ABSTRACT:
A first alignment mark member is exposed at both of a mounting surface and a bonding surface, and thus can be seen from two directions by image sensors. While a semiconductor laser device is mounted on the mounting surface of a light source supporting substrate with reference to the first alignment mark member observed from the direction of the image sensor, the first alignment mark member can also be observed from the direction of the image sensor. With reference to the first alignment mark member observed from the latter direction, the light source supporting substrate is bonded to the slider substrate. Namely, though observed from different directions, the alignment mark member is used for a common reference for two securing operations, whereby attachment errors can be suppressed.

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patent: A-2003-114184 (2003-04-01), None
patent: A-2006-185548 (2006-07-01), None

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