Semiconductor laser device manufacturing method and...

Details Semiconductor laser device manufacturing method and... Semiconductor laser device manufacturing method and...

2005-11-08

2009-12-08

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S026000, C438S466000, C257SE21521, C257SE21522, C257SE21525, C257SE21529, C257SE21530, C257SE21531

Reexamination Certificate

active

07629185

ABSTRACT:
A semiconductor laser device manufacturing method includes, sequentially, a first aging step S1,a first inspection step S2,a mounting step S3,a second aging step S4and a second inspection step S5.Since the first aging step S1on a semiconductor laser chip with a high-temperature direct current conduction is performed before the mounting step S3,threshold current and drive current of the semiconductor laser chip before mounting can be reduced.

REFERENCES:
patent: 4817849 (1989-04-01), Yamamoto et al.
patent: 4-184175 (1992-07-01), None
patent: 5-275813 (1993-10-01), None
patent: 10-321685 (1998-12-01), None

Affiliated with

Also associated with

Rating

Semiconductor laser device manufacturing method and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor laser device manufacturing method and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor laser device manufacturing method and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4144248