Semiconductor laser, device having reduced contact...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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C438S031000, C438S032000, C438S669000, C438S673000, C438S720000, C438S742000, C438S508000, C257SE33007

Reexamination Certificate

active

07029936

ABSTRACT:
A semiconductor laser element capable of reducing the contact resistance and the thermal resistance and realizing a high reliability is provided. The semiconductor laser element includes: a semiconductor substrate, an active layer formed on the semiconductor substrate, a ridge having a clad layer formed on the active layer and a contact layer formed on the clad layer, an insulation film covering the side surfaces of the clad layer, and an electrode connected to the contact layer, wherein the insulation layer has an end portion in the ridge thickness direction located between the upper surface and the lower surface of the contact layer.

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Lin et al., “High-Temperature, Low Threshold Current, and Uniform Operation 1×12 Monolithic A1GaInAs/InP Strain-Compensated Multiple Quantum Well Laser Array in 1.5 μm,”IEEE Transactions on Electron Devices, Aug. 1999, vol. 46, No. 8, pp. 1614-1618.

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