Semiconductor laser device having incomplete bonding region...

Coherent light generators – Particular temperature control

Reexamination Certificate

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C372S036000, C372S043010

Reexamination Certificate

active

07606275

ABSTRACT:
There is provided a semiconductor laser device capable of reducing stress occurring to a semiconductor laser element so that a life of the semiconductor laser device can be prolonged. In this semiconductor laser device, a solder layer114is absent over a first region R1ranging to a specified length L1in a perpendicular direction X from a center line J1of a light-emitting region150toward both sides of the perpendicular direction X. That is, the first region R1over which the light-emitting region150is present serves as an incomplete bonding region between the solder layer114of the semiconductor laser element100and a heat sink200. Thus, stress given to the light-emitting region150due to differences in coefficient of thermal expansion among the semiconductor laser element100, the solder layer114and the heat sink200during operation is reduced.

REFERENCES:
patent: 5729561 (1998-03-01), Hironaka
patent: 6967980 (2005-11-01), Kawai
patent: 3461632 (2003-08-01), None
patent: 2004-096062 (2004-03-01), None

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