Semiconductor laser device and method for fabricating the same

Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation

Reexamination Certificate

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C438S460000, C438S068000, C438S113000

Reexamination Certificate

active

06930024

ABSTRACT:
A first semiconductor laminated structure including a first active layer for oscillating a first laser beam having a first wavelength band is provided on a front-side region of a substrate. A second semiconductor laminated structure including a second active layer for oscillating a second laser beam having a second wavelength band is provided on a rear-side region of the substrate. An emission direction of the first laser beam and an emission direction of the second laser beam are same.

REFERENCES:
patent: 4680769 (1987-07-01), Miller
patent: 5070509 (1991-12-01), Meyers
patent: 5708674 (1998-01-01), Beernink
patent: 6661824 (2003-12-01), Onishi
patent: 08-018154 (1996-01-01), None
patent: 11-186651 (1999-07-01), None
K. Nemoto et al., “A Laser Coupler for DVD/CD Playback by Using Monolithic Integrated 2-Wavelength LDs”, Sep. 1999, 3a-ZC-10, The 60thAutumn Technical Meeting of The Japan Society of Applied Physics.

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