Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device
Reexamination Certificate
2007-05-29
2007-05-29
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Having diverse electrical device
C438S026000, C438S106000, C257SE33056
Reexamination Certificate
active
10629544
ABSTRACT:
A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.
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Adachi Hideto
Inoue Hiroto
Iwata Yukihiro
Mochida, legal representative Korekazu
Mochida, legal representative Kyoko
Matsushita Electric - Industrial Co., Ltd.
Mulpuri Savitri
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