Electric heating – Metal heating – For bonding with pressure
Patent
1981-08-17
1983-06-21
Reynolds, B. A.
Electric heating
Metal heating
For bonding with pressure
219 85M, 219 85CA, 228222, 228123, H01L 2158
Patent
active
043895573
ABSTRACT:
In a method and apparatus for bonding a semiconductor laser chip to a heatsink and testing the bond obtained, temperature in the bonding operation is regulated by passing a small fixed current through the forward biased laser and monitoring corresponding change in voltage caused by alteration of the laser pn junction temperature. Current is passed to the laser through a floating contact consisting of a conducting vacuum pick-up pressed against the laser top surface. Bond integrity is subsequently tested at low temperature by passing a dc current greater than a threshold current through the laser and measuring the resulting light output and then passing a pulsed current with identical peak current level and again measuring light output. The difference in light output is a function of the bond thermal resistance.
REFERENCES:
patent: 2978570 (1961-04-01), Hanlein
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4321617 (1982-03-01), Duda et al.
Devenyi Tibor F.
Kovats Tibor F. I.
Look Christopher M.
Northern Telecom Limited
Reynolds B. A.
Sigda Catherine M.
Wilkinson Stuart L.
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