Semiconductor laser assembly

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437902, 372 36, 372 43, 357 81, 228904, H01L 2516

Patent

active

049961691

ABSTRACT:
A semiconductor laser assembly is provided with a photodetector module and a laser module mounted on orthogonal surfaces of a heatsink. The photodetector module includes a photodetector and two electrically isolated wire bond blocks, each with two surfaces parallel to the orthogonal surfaces of the heatsink. The laser module includes a laser diode bonded and a wire bond region with two surfaces also parallel to the orthogonal surfaces of the heatsink. Both of the wire bond block surfaces of the photodetector modules are thus parallel to the wire bond region surfaces on the laser module, allowing wire connections to be made between parallel surfaces before the heat sink is mounted on a header. One of the surfaces of each of the wire bond blocks and regions is parallel to the pins of a header, allowing attachment of wires from the photodetector module and the laser module to the pins without rotating the header and pins.

REFERENCES:
patent: 4403243 (1983-09-01), Hakamada
patent: 4604753 (1986-08-01), Sawai
patent: 4757197 (1988-07-01), Lee
patent: 4818099 (1989-04-01), Preikschat et al.
patent: 4847848 (1989-07-01), Inoue et al.
patent: 4924473 (1990-05-01), Burgyan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor laser assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor laser assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor laser assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-293829

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.