Semiconductor laser apparatus

Details Semiconductor laser apparatus Semiconductor laser apparatus

1989-10-30

1991-11-26

Sikes, William L.

Coherent light generators

Particular temperature control

Heat sink

372 49, 357 72, H01S 3025, H01L 2328

Patent

active

050688669

ABSTRACT:
A laser chip is directly disposed on a support member through a mounting arrangement and a support member, the laser chip, and peripheral parts thereof are integrally sealed within a transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.

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Patent Abstracts of Japan, vol. 9, No. 197, JP-A-60 063 977 (Mitsubishi Denki K.K., p. 197, Aug. 14, 1985.
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Journal of Lightwave Technology, vol. LT-5, No. 9, Sep. 1987, pp. 1263-1268, New York, US; Y. Nakajima et al., "High-Power High-Reliability Operation of 1.3-mum p-substrate Buried Crescent Laser Diodes".

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