Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor
Patent
1999-07-09
2000-10-31
Bowers, Charles
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Compound semiconductor
438 39, H01L 2120
Patent
active
061401420
ABSTRACT:
A semiconductor laser device according to the present invention includes: a semiconductor substrate having a first conductivity type; and a semiconductor multilayer structure provided on the semiconductor substrate, the semiconductor multilayer structure including an active layer. The semiconductor multilayer structure includes: a lower cladding layer provided below the active layer, the lower cladding layer having the first conductivity type; an upper cladding structure provided above the active layer, the upper cladding structure having a second conductivity type; and a cap layer provided above the upper cladding structure. A ridge is formed in the upper cladding structure, and a width of a lower face of the cap layer is larger than a width of an upper face of the ridge.
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Patent Abstracts of Japan, vol. 015, No. 280 (E-1090), Jul. 16, 1991, & JP 03 097286 A (Mitsubishi Electric Corp.), Apr. 23, 1991.
Ikeda Hiroaki
Ohbayashi Ken
Bowers Charles
Christianson Keith
Sharp Kabushiki Kaisha
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