Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate
2006-01-03
2006-01-03
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Portion of housing of specific materials
C257S783000, C156S330000, C438S118000
Reexamination Certificate
active
06982484
ABSTRACT:
The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state.(1) The coefficient of linear expansion in the film transverse direction (TD) at 50–200° C. is 17–30 ppm/° C.(2) The tensile modulus of elasticity is 6–12 GPaBy means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables, the reliability of semiconductor devices for high density mounting to be enhanced.
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Supplementary European Search Report (Jan. 28, 2005).
Kamei Ryuichi
Kigoshi Syouji
Ogura Mikihiro
Shimizu Ken
Tokunaga Masami
Chambliss Alonzo
Morrison & Foerster / LLP
Toray Industries Inc.
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