Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2011-06-14
2011-06-14
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S734000
Reexamination Certificate
active
07960839
ABSTRACT:
An interconnection line of a semiconductor device and a method of forming the same using a dual damascene process are disclosed. An example interconnection line of a semiconductor device includes a semiconductor substrate, a first interconnection line formed on the substrate, an insulating layer pattern formed on the substrate to expose a portion of the first interconnection line, and a metal pad layer formed on the exposed portion of the first interconnection line. The example interconnection line also includes an intermediate insulating layer formed on the entire surface of the substrate and having a via hole and a trench exposing the metal pad layer, and a second interconnection formed in the via hole and the trench and electrically connected to the first interconnection line through the metal pad layer.
REFERENCES:
patent: 5939788 (1999-08-01), McTeer
patent: 6084304 (2000-07-01), Huang et al.
patent: 6559548 (2003-05-01), Matsunaga et al.
patent: 6747355 (2004-06-01), Abiru et al.
patent: 6879042 (2005-04-01), Ohto et al.
patent: 7056820 (2006-06-01), Cole et al.
patent: 7223686 (2007-05-01), Bae
Dongbu Electronics Co. Ltd.
Fortney Andrew D.
Nelson William K.
Potter Roy K
The Law Offices of Andrew D. Fortney
LandOfFree
Semiconductor interconnection line and method of forming the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor interconnection line and method of forming the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor interconnection line and method of forming the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2715117