Semiconductor interconnect having test structures for evaluating

Details Semiconductor interconnect having test structures for evaluating Semiconductor interconnect having test structures for evaluating

1996-05-01

1998-11-17

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324765, G01R 3102

Patent

active

058381619

ABSTRACT:
An interconnect for a semiconductor die includes integrally formed test structures for evaluating various electrical characteristics of the interconnect. The test structures can include Kelvin structures, van der Pauw structures, resistors, capacitors, contact chains, via chains, serpentine test structures, and antenna test structures. Among the electrical characteristics that can be evaluated are the resistivity of contact member, conductor and substrate components of the interconnect, contact resistance between the contact members and conductors and capacitance of the contact members and conductors with respect to the substrate.

REFERENCES:
patent: 3777260 (1973-12-01), Davies et al.
patent: 4243937 (1981-01-01), Multani et al.
patent: 5034796 (1991-07-01), Zommer
patent: 5150042 (1992-09-01), Look et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5419807 (1995-05-01), Akram et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5495179 (1996-02-01), Wood et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5517515 (1996-05-01), Spall et al.
patent: 5523697 (1996-06-01), Farnworth et al.
patent: 5572140 (1996-11-01), Lim et al.
patent: 5721496 (1998-02-01), Farnworth et al.
patent: 5742169 (1998-04-01), Akram et al.
Schroder, Dieter K., Semiconductor Material and Device Characterization, John Wiley & Sons Inc., pp. 9-13, 110-129, 286-288, 1990. (Month Unavailable).

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