Semiconductor integrated device including support substrate...

Details Semiconductor integrated device including support substrate... Semiconductor integrated device including support substrate...

2006-09-19

2006-09-19

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S124000, C438S122000, C438S126000, C438S113000, C257S753000, C257S789000, C257S795000, C257SE23140, C257SE23160, C257SE23116

Reexamination Certificate

active

07109062

ABSTRACT:
A semiconductor integrated device, provided with a semiconductor chip on which a semiconductor integrated circuit is formed and a support substrate laminated on at least one surface of the semiconductor chip, wherein the semiconductor chip and the support substrate are fastened using resin having particle-the minimum film thickness of the resin is larger than the maximum particle diameter of the filler.

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URL http://www.shellcase.com/pages//products-shellOP-process.asp.

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