Semiconductor integrated device having parallel signal lines

Details Semiconductor integrated device having parallel signal lines Semiconductor integrated device having parallel signal lines

1995-09-25

1996-06-04

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257738, 257777, 257778, 257750, 257698, 257735, 257686, 257704, H07L 3902

Patent

active

055236227

ABSTRACT:
For taking a characteristic impedance matching of signal transmission lines in a package which carries thereon a semiconductor chip with a very high-speed LSI formed thereon, there is provided a semiconductor integrated circuit device wherein one ends of signal transmission lines formed on a main surface of a package substrate are extended up to the position just under pads formed on a main surface of the semiconductor chip and are connected to the pads on the chip electrically through bump electrodes, while opposite ends of the signal transmission lines are extended to the outer peripheral portion of the main surface of the package substrate and outer leads are bonded thereto.

REFERENCES:
patent: 4183041 (1980-01-01), Goel
patent: 4710798 (1987-12-01), Marcantonio
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5381039 (1995-01-01), Morrison

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