Semiconductor integrated circuits with specific pitch multilevel

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

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257758, 257773, H01L 2710

Patent

active

056314787

ABSTRACT:
A multilevel interconnection structure for semiconductor integrated circuits has five or more multiple interconnection layers, each of which includes a plurality of interconnections, wherein the lower level interconnections included in first to third interconnection layers form the lowest level interconnection layer have pitches less than 2 micrometers and the high level interconnections included in the remaining interconnection layers have pitches in the range from 2 to 3 micrometers.

REFERENCES:
patent: 5060045 (1991-10-01), Owada et al.
patent: 5119170 (1992-06-01), Iwamatsu
Denboer, A.; "Inside Today's Leading Edge Microprocessors," Semiconductor International, Feb., 1994.

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