Semiconductor integrated circuit testing apparatus and...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S1540PB

Reexamination Certificate

active

06255843

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor integrated circuit testing apparatus for testing various kinds of semiconductor integrated circuits (a semiconductor integrated circuit will be hereinafter referred to as IC) and a composite semiconductor integrated circuit testing apparatus that is constructed such that a plurality of semiconductor integrated circuit testing apparatus of such type are combined so as to be able to test a large scale integrated circuit (LSI), particularly a large scale integrated circuit having many pins.
2. Description of the Related Art
As is well known, in this technical field, a semiconductor integrated circuit (hereinafter referred to as IC) in which a logic circuit portion (logic portion) is dominant is called “logic IC”, and a semiconductor integrated circuit in which a memory portion is dominant is called “memory IC”. In addition, an IC in which a logic portion and a memory portion are present in mixture on one chip is called “System LSI” (Systematic Large Scale Integrated Circuit), “System On Chip” (SOC) or the like.
FIG. 4
shows, in outline, a configuration of the general IC testing apparatus (hereinafter referred to as an IC tester) that has conventionally been used. The illustrated IC tester comprises an IC tester proper
100
and a test head
200
. The IC tester proper
100
comprises, in this example, a controller
101
, a timing generator
102
, a pattern generator
103
, a waveform formatter
104
, a driver
105
, a comparator
106
, a logical comparator
107
, a failure analysis memory
108
and a voltage generator
109
.
The test head
200
is constructed separately from the IC tester proper
100
, and usually has a predetermined number of IC sockets (not shown) mounted on its top portion. In addition, within the test head
200
is accommodated a printed board called “pin card” in this technical field. A circuit containing the driver
105
and the comparator
106
of the IC tester proper
100
is usually formed on the pin card. In general, the test head
200
is mounted to a test section of an IC transporting and handling apparatus called “handler” in this technical field. The test head
200
is electrically connected to the IC tester proper
100
by signal transmission means such as cables, optical fibers or the like.
An IC to be tested (IC under test)
300
is mounted on an IC socket on the test head
200
, through which a test pattern signal is applied to the IC under test (generally referred to as DUT)
300
from the IC tester proper
100
as well as a response signal from the IC under test
300
is supplied to the IC tester proper
100
in order to test and measure the IC under test
300
.
The controller
101
is constituted by a computer system, in which a test program created by a user (programmer) is stored, and the entire IC tester is controlled in accordance with the test program. As can be easily understood by referring to
FIG. 5
, the controller
101
is connected to the timing generator
102
, the pattern generator
103
, the waveform formatter
104
, the logical comparator
107
, the failure analysis memory
108
, the voltage generator
109
, and the like via a tester bus
111
. These timing generator
102
, pattern generator
103
, waveform formatter
104
, logical comparator
107
, failure analysis memory
108
, voltage generator
109
, and the like operate as terminal devices and carry out a test for the IC under test
300
in accordance with control instructions or commands outputted from the controller
101
.
A test, for example, a functional test for the IC under test is performed as follows.
A pattern generating sequence described in the test program stored in the controller
101
is previously stored in the pattern generator
103
prior to the start of a test. When a test start instruction is given thereto from the controller
101
, the pattern generator
103
outputs test pattern data to be applied to the IC under test
300
in accordance with the stored pattern generating sequence. As the pattern generator
103
, an ALPG (Algorithmic Pattern Generator) is generally used. The ALPG is a pattern generator that generates a test pattern to be applied to a semiconductor device (for example, an IC) by an arithmetic and logic operation or computation using internal registers each having an arithmetic and logic function or computing function.
Timing generator
102
has timing data previously stored therein prior to the start of a test, the timing data being described in the test program stored in the controller
101
and outputted for every test period. The timing generator
102
outputs a clock pulse for each test period in accordance with the stored timing data. This clock pulse is supplied to the waveform formatter
104
, the logical comparator
107
and the like.
The waveform formatter
104
defines a rise timing and a fall timing of a logical waveform, based on the test pattern data outputted from the pattern generator
103
and the clock pulse outputted from the timing generator
102
, to produce a test pattern signal having a real waveform that changes from/to logical H (logical “1”) to/from logical L (logical “0”). This test pattern signal is applied to the IC under test
300
via the driver
105
.
The driver
105
defines the amplitude of the test pattern signal outputted from the waveform formatter
104
to a desired amplitude (logical H, i.e., voltage VIH of logical “1” and logical L, i.e., voltage VIL of logical “0”) and applies such test pattern signal to the IC socket of the test head
200
, thereby to drive the IC under test
300
.
The comparator
106
determines whether or not a logical value of a response signal outputted from the IC under test
300
has a normal voltage value. That is, the comparator
106
determines whether or not a voltage of logical H has a value equal to or greater than a defined voltage value VOH and whether or not a voltage of logical L has a value equal to or less than a defined voltage value VOL. In the case that the determination result indicates a failure, the comparator
106
outputs a signal of logical H (logical “1”) indicating the failure.
An output signal based on the determination result of the comparator
106
is supplied to the logical comparator
107
where the output signal is compared with an expected value pattern data supplied from the pattern generator
103
to determine whether or not the IC under test
300
has outputted a normal response signal.
The comparison result of the logical comparator
107
is taken in the failure analysis memory
108
. In the case that a failure has occurred, the test pattern address of the failure, the output logical data of the failure pin of the IC under test
300
, and the expected value pattern data at that time are stored in the failure analysis memory
108
, and these data are utilized for an evaluation of the LSI after the completion of the test.
The voltage generator
109
generates amplitude voltages VIH and VIL to be applied to the driver
105
, and comparison voltages VOH and VOL to be applied to the comparator
106
, in accordance with a set value being sent from the controller
101
. As a result, there is generated from the driver
105
a driving signal having an amplitude value which fulfills the standard of the IC under test
300
. In addition, the comparator
106
can determine whether or not the response signal from the IC under test
300
has a logical value of the voltage fulfilling the standard of the IC under test
300
.
FIG. 4
is illustrated such that a test pattern signal outputted from the driver
105
is applied to only one pin of the IC under test
300
and that a response signal from that one pin of the IC under test
300
is supplied to the comparator
106
. However, in practice, a predetermined number, for example,
512
of drivers
105
are provided, and also the same predetermined number (
512
) of comparators
106
as that of the drivers
105
are provided. In
FIG. 5
, in order to simplify the figure, each of the components (the controll

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