Semiconductor integrated circuit having at least one of a...

Active solid-state devices (e.g. – transistors – solid-state diode – With passive device

Reexamination Certificate

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C257S698000, C257S781000, C257S786000

Reexamination Certificate

active

06924562

ABSTRACT:
A semiconductor integrated circuit is provided. A semiconductor package having a printed circuit board, a semiconductor chip mounted on a first surface of said printed circuit board, at least one power supply electrode on a second surface of said printed circuit board and connected to at least one power supply terminal of said semiconductor, and at least one ground electrode on a second surface of said printed circuit board and connected to at least one ground terminal of said semiconductor chip; a decoupling capacitor outside said semiconductor package and formed by a power supply plane connected to said power supply electrodes, and a ground plane connected to said ground electrodes; at least one power supply electrode pad connected to said power supply plane; and at least one ground electrode pad connected to said ground plane.

REFERENCES:
patent: 5973928 (1999-10-01), Blasi et al.
patent: 6335566 (2002-01-01), Hirashima et al.
patent: 6643916 (2003-11-01), Larson
patent: 2002/0088977 (2002-07-01), Mori et al.
patent: 2003/0011960 (2003-01-01), Koning et al.
patent: 2003/0076197 (2003-04-01), Novak et al.
patent: 2000-307005 (2000-11-01), None
patent: 2001-44591 (2001-02-01), None
patent: 2001-284483 (2001-10-01), None

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