Semiconductor integrated circuit having an improved arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

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257207, 257758, H01L 27118

Patent

active

059490985

ABSTRACT:
A semiconductor integrated circuit is capable of reducing noise which occurs when, for example, power is removed from the circuit. The semiconductor integrated circuit includes a power wiring layer 110 used for a power conductive line 111, a first insulating layer 120 for providing electrical isolation between the power wiring layer 110 and a ground wiring layer 130 and having a through hole 121 therein enabling electrical connection between the power conductive line 111 and a first signal conductive line 151. The ground wiring layer 130 is used for each ground conductive line 132. The circuit also includes a power conductive line 131 so as to allow an electrical connection between the power conductive line 111 and the first signal conductive line 151, a second insulating layer 140 capable of providing electrical isolation between the ground conductive line 130 and a signal wiring layer 150, having a through hole 141 therein enabling an electrical connection between the power conductive line 111 and the first signal conductive line 151. The circuit further includes a through hole 142 defined therein enabling an electrical connection between the ground conductive line 132 and a second signal conductive line 152. The circuit also includes signal wiring layer 150 having first, second and third signal conductive lines 151, 152 and 153.

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