Semiconductor integrated circuit having a plurality of semicondu

Details Semiconductor integrated circuit having a plurality of semicondu Semiconductor integrated circuit having a plurality of semicondu

1996-04-25

1998-08-11

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257777, 257724, H01L 2334

Patent

active

057931089

ABSTRACT:
A central portion of a front surface of a first semiconductor chip is bonded to a first surface of a die pad of a lead frame via an elastic insulating film. A peripheral portion having electrodes of the front surface is outside of the die pad. With a back surface of the first semiconductor chip put in contact with a jig surface, wire bonding of the first semiconductor chip is performed. Then, with a second surface of the die pad opposite from the first semiconductor chip put in contact with a jig surface, a back surface of a second semiconductor chip is bonded to the back surface of the semiconductor chip via an adhesive. With the second surface of the die pad put in contact with a jig surface, wire bonding of the second semiconductor chip is performed.

REFERENCES:
patent: 4251852 (1981-02-01), Ecker et al.

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