Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1990-11-14
1992-11-10
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257692, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
051628945
ABSTRACT:
A semiconductor integrated circuit includes a semiconductor chip having a plurality of pad electrodes fixed in a lead frame. Electrical leads connected to the chip include outer lead portions, external to the lead frame, and inner lead portions, internal to the lead frame and electrically connected to the semiconductor chip. At least one lead is a dummy lead, providing additional space in the lead frame. Due to the extra space, the inner lead portions may have various shapes, including large leads, or branched leads, for elimination power noise.
REFERENCES:
patent: 4010488 (1977-03-01), Gruszka et al.
patent: 4099200 (1978-07-01), Koutalides
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 4466183 (1984-08-01), Barns
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4814855 (1989-03-01), Hodgson et al.
European Search Report EP 89 10 9390, dated Nov. 27, 1990.
Japanese 57-164548, Sep. 10, 1982, Patent Abstracts of Japan, Jan. 8, 1983.
Asano Masamichi
Iwahashi Hiroshi
Kishi Hiroaki
Kobayashi Kiyoshi
Jackson, Jr. Jerome
Kabushiki Kaisha Toshiba
Monin D.
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