Patent
1989-07-17
1990-06-26
Mintel, William
357 68, 357 71, 357 236, 357 40, 357 41, 357 55, H01L 2702
Patent
active
049376497
ABSTRACT:
A semiconductor integrated circuit includes a semiconductor substrate, a plurality of logic gates formed in the semiconductor substrate, power source wiring and ground wiring formed on the semiconductor substrate to supply power source voltage to the logic gates and a capacitor formed on the semiconductor substrate and distributively connected between the power source wiring and the ground wirings.
REFERENCES:
patent: 4249196 (1981-02-01), Durney et al.
patent: 4455568 (1984-06-01), Shiota
patent: 4583111 (1986-04-01), Early
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4737830 (1988-04-01), Patel et al.
Mikoshiba Hiroaki
Shiba Hiroshi
Mintel William
NEC Corporation
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