Semiconductor integrated circuit fabrication yield improvements

Details Semiconductor integrated circuit fabrication yield improvements Semiconductor integrated circuit fabrication yield improvements

1990-03-02

1992-07-07

Hille, Rolf

357 71, H01L 2702

Patent

active

051287374

ABSTRACT:
Microelectronic integrated circuit fabrication yield is improved through architecture which provides for the search and identification and avoidance of electronic malfunctions in wafer sub-circuits, each of which perform an identical function, such as memory. A processor contained within each wafer performs these search, identification and repair functions via communication pathways (busses) formed on the wafer. The processor records the location and type of electronic defects within each sub-circuit and reconfigures the balance of the circuitry included within the overall circuit to provide for a useful overall electronic circuit function using the sub-circuit building blocks.

REFERENCES:
patent: 4329685 (1982-05-01), Mahon et al.
patent: 4868789 (1989-09-01), MacDonald
patent: 4920403 (1990-04-01), Chow et al.
patent: 5008723 (1991-04-01), van der Have
"Semiconductor Technology Handbook", Technology Associates Inc., pp. 15--3-15--7 (1982).
"ULSI Technology", S. M. Sze, McGraw Hill, pp. 607-612 (1983).

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