Semiconductor integrated circuit devices

Details Semiconductor integrated circuit devices Semiconductor integrated circuit devices

1975-10-20

1977-05-03

Wojciechowicz, Edward J.

357 45, 357 52, 357 55, 357 70, H01L 2710, H01L 2934, H01L 2906, H01L 2348

Patent

active

040218384

ABSTRACT:
A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallization thereon, one acting as an earth (or ground) return plane and the other providing power voltages. Dependent contacts on the chip make selective contact with metallization over the surface of the semiconductor wafer on which the chip is mounted. A power distribution line consists of a number of such bus elements linked together.

REFERENCES:
patent: 3748548 (1973-07-01), Haisty et al.
patent: 3947840 (1976-03-01), Craford et al.
IBM - Tech. Bul. -- vol. 15, No. 2, July 1972, Bodendorf et al., pp. 656-657.

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