Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-11-01
2005-11-01
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257S778000, C257S784000, C257S780000, C257S734000, C257S772000, C257S775000, C257S781000
Reexamination Certificate
active
06960830
ABSTRACT:
A semiconductor integrated circuit device which requires high packaging density adopts a method for forming bumps in a terminal section of a semiconductor chip and bonding the semiconductor chip directly on a substrate. In this case, in order to prevent damage to the semiconductor integrated chip, which would otherwise be caused by bonding pressure employed at the time of bonding operation, non-connected dummy bumps are provided at corner sections of the semiconductor chip. Even when the dummy bumps are provided, there arises a necessity for preventing an increase in the size of the semiconductor chips, which would otherwise arise when the dummy bumps are provided on the chip.
REFERENCES:
patent: 5814891 (1998-09-01), Hirano
patent: 6287895 (2001-09-01), Sato
patent: 6677677 (2004-01-01), Kimura et al.
patent: 6756686 (2004-06-01), Iwasaki et al.
patent: 2001/0051396 (2001-12-01), Iwahashi et al.
patent: 2002/0167623 (2002-11-01), Aruga et al.
patent: 2002/0190336 (2002-12-01), Shimizu et al.
patent: 2003/0060035 (2003-03-01), Kimura et al.
patent: 2003/0092326 (2003-05-01), Nishikawa et al.
patent: 2004/0017008 (2004-01-01), Ueda
patent: 6-29296 (1924-02-01), None
patent: 1-238148 (1989-09-01), None
patent: 4-94732 (1992-08-01), None
patent: 7-263488 (1995-10-01), None
patent: 8-46313 (1996-02-01), None
patent: 9-115910 (1997-05-01), None
patent: 9-246426 (1997-09-01), None
patent: 10-154726 (1998-06-01), None
patent: 2001-35872 (2001-02-01), None
patent: 2003-17530 (2003-01-01), None
patent: 2003-100949 (2003-04-01), None
patent: 2003-234435 (2003-08-01), None
patent: 2003-282812 (2003-10-01), None
Hamre Schumann Mueller & Larson P.C.
Rohm & Co., Ltd.
Williams Alexander Oscar
LandOfFree
Semiconductor integrated circuit device with dummy bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit device with dummy bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device with dummy bumps will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3499381