Semiconductor integrated circuit device with cooling system and

Details Semiconductor integrated circuit device with cooling system and Semiconductor integrated circuit device with cooling system and

1992-08-25

1993-10-05

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 165 803, 165 804, 174 163, 257706, 257713, 361689, 361699, 361707, H05K 720

Patent

active

052511006

ABSTRACT:
A semiconductor integrated circuit device is equipped with a cooling system which serves to cool a plurality of integrated circuit chips mounted on a circuit board. The cooling system is kept in contact with the upper surfaces of the plurality of integrated circuit chips. A chip surface arranging plate of uniform thickness is formed with apertures smaller than the integrated circuit chips mounted on the circuit board. The cooling system is fixed on the chip surface arranging plate. The upper surfaces of the integrated circuit chips are substantially kept flush by the chip surface arranging plate. Further, the integrated circuit chips are thermally joined to the cooling system so that heat generated by the integrated circuit chips is removed by the cooling system. The plurality of integrated circuit chips are joined to the chip surface arranging plate by applying a vacuum that causes suction of air through the apertures formed in the chip surface arranging plate. Thereafter, the cooling system is fixed to the chip surface arranging plate.

REFERENCES:
patent: 4558395 (1985-12-01), Yamada et al.

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