Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2006-08-22
2006-08-22
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S762000, C257S763000, C257S774000
Reexamination Certificate
active
07095120
ABSTRACT:
In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.
REFERENCES:
patent: 5309023 (1994-05-01), Motonami et al.
patent: 5371041 (1994-12-01), Liou et al.
patent: 5739579 (1998-04-01), Chiang et al.
patent: 5891513 (1999-04-01), Dubin et al.
patent: 6157078 (2000-12-01), Lansford
patent: 6181012 (2001-01-01), Edelstein et al.
patent: 6586842 (2003-07-01), You et al.
patent: 6590288 (2003-07-01), Woo et al.
“Semicon West 2000 ” Nikkei Microdevices, pp. 65-66.
Ashihara Hiroshi
Ishikawa Kensuke
Miyauchi Masanori
Saito Tatsuyuki
Saito Toshio
Antonelli, Terry Stout and Kraus, LLP.
Cao Phat X.
Renesas Technology Corp.
LandOfFree
Semiconductor integrated circuit device with a connective... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit device with a connective..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device with a connective... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3677400