Semiconductor integrated circuit device of multilayer interconne

Details Semiconductor integrated circuit device of multilayer interconne Semiconductor integrated circuit device of multilayer interconne

1989-03-03

1990-11-13

Hille, Rolf

357 68, 357 65, 357 54, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

049705725

ABSTRACT:
A semiconductor integrated circuit device of multi-layer interconnection structure includes a pad formed of a multilayer interconnection layer. The power source pad is connected to a power source interconnection layer via a lead-out interconnection layer which is formed of the same multilayer interconnection layer as that used to form the power source pad.

REFERENCES:
patent: 4021838 (1977-05-01), Warwick
patent: 4594606 (1986-06-01), Goto et al.

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